BBL-123-G-E的详细信息

Standard Package	1
Category	Connectors, Interconnects
Family	Rectangular - Board to Board Connectors - Headers, Male Pins
Series	BBL
Packaging	Bulk
Connector Type	Unshrouded
Number of Positions	23
Number of Positions Loaded	All
Pitch	0.100" (2.54mm)
Number of Rows	1
Row Spacing	-
Height Stacking (Mating)	-
Molding Height Above Board	0.070" (1.78mm)
Contact Mating Length	0.105" (2.67mm)
Mounting Type	Through Hole
Termination	Solder
Contact Finish	Gold
Contact Finish Thickness	20µin (0.51µm)
Features	-
Color	Black
Dynamic Catalog	BBL Series
Mating Products	SAM1110-23-ND - CONN RCPT .100" 23POS TIN PCBSAM1109-23-ND - CONN RCPT .100" 23POS TIN PCBSAM1108-23-ND - CONN RCPT .100" 23POS TIN PCBSAM1107-23-ND - CONN RCPT .100" 23POS GOLD PCBSAM1106-23-ND - CONN RCPT .100" 23POS GOLD PCBSAM1105-23-ND - CONN RCPT .100" 23POS GOLD PCBSAM1104-23-ND - CONN RCPT .100" 23POS GOLD PCBSAM1103-23-ND - CONN RCPT .100" 23POS GOLD PCBSAM1102-23-ND - CONN RCPT .100" 23POS GOLD PCB
Other Names	SAM1000-23

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DLP-HS-FPGA

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