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HC1000-0.020-02-0404

Bergquist

热量管理热 - 垫,片

thermal pad 20mil 4x4 GAPpad

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HC1000-0.020-02-0404的详细信息

Standard Package100
CategoryFans, Thermal Management
FamilyThermal - Pads, Sheets
SeriesGap Pad® HC1000
Usage-
ShapeSquare
Outline101.60mm x 101.60mm
Thickness0.020" (0.508mm)
MaterialPolymer
AdhesiveTacky - Both Sides
Backing, CarrierFiberglass
ColorGray
Thermal Resistivity-
Thermal Conductivity1.0 W/m-K
Other NamesGAPPADHC100020MILQ1144077

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DLP-HS-FPGA

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型号分类描述制造商
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1009-54热量管理热 - 垫,片heat sink pad to-220Bergquist
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SP600-25热量管理热 - 垫,片thermal pad do-5 large sp600Bergquist
Q3-0.005-00-22热量管理热 - 垫,片thermal pad do-4 large Q3Bergquist
Q3-0.005-00-25热量管理热 - 垫,片thermal pad do-5 large Q3Bergquist
SPT400-12-11-25热量管理热 - 垫,片therm pad to-220 tube 11x25mmBergquist
SP400-0.007-00-...热量管理热 - 垫,片thermal pad rh-25 sp400Bergquist
SPT400-12-13.5-...热量管理热 - 垫,片therm pad to-247 tube 13.5x25mmBergquist
SP2000-0.015-00...热量管理热 - 垫,片thermal pad to-220 .015 sp2000Bergquist

参考报价(批量:单位)

  • 数量价格(美元)
  • 2005.58900