器件名称TI

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产品TMP302TI
描述

TMP302 是一款采用微封装 (SOT563) 的温度开关。TMP302 可通过引脚来选择跳闸点和滞回温度,因而具有低功耗(最大 15µA)且简单易用。

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制造商型号分类描述下载
Mill-Max

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0548-0-15-01-21...机电产品硬件circuit board hardware - pcb 200u sn/pb over NI 21 con
Molex

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Mill-Max

0548-0-15-80-21...机电产品硬件circuit board hardware - pcb 200u SN over NI 21 con
Mill-Max

Mill-Max

0548-0-15-80-21...机电产品硬件circuit board hardware - pcb 200u SN over NI 21 con
Mill-Max

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Molex

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0548092175连接器FFC,FPC(扁平柔性)连接...conn ffc/fpc 21pos .3mm smd r/a
Mill-Max

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0548-0-15-15-21...机电产品硬件circuit board hardware - pcb 10u AU over NI 21 con